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Applications spéciales

HP2

Including:

  • Dimensional control, surface quality evaluation and form recognition by CCD camera, independent of the machine (Magnification x10)
  • Toolmonitoring and breakage detection by laser
  • Part measurement by 3D probe with infrared communication
  • Vibration monitoring, analysis, protection, and optimisation in Real time by adaptative control of spindle speed and cutting feed rates

CEA

Exceptional precision lathe

  • Form defect max: 1μm for ø200 mm
  • Roughness Ra < 0.1 μm